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  1. #1
    Non-sane user 1nsane's Avatar
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    10+ idle

    , - .
    - - , .. (+/- 2-3) 50 . , , 55 , ( + , ), overheat- WinRAR ( RMClock , / , ) - 95 , . , - idle 43-44 , 67-8 . , , , 43 57-8, - , 43-44, ( , ), 57-8 . 3 , , , - , , ( - [AS5, ]). 70 , -> heatpipe -> . , , , 50 , - ( 100% , , ).
    - - 43-44 57-58 ? , , - , . , .
    - (Dell M1530) , , , .
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  2. #2
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    . 90 . 50 . , 10-15% . ( 55 ) - 53 58. 3 4 10. .

  3. #3
    Registered User suren's Avatar
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    10 . ~36-48 . CPU 56-65 GPU-. . BIOS (A12), nvidia. .
    Lenovo Thinkpad Yoga 15

  4. #4
    Non-sane user 1nsane's Avatar
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    nVidia, . .. ( , inquirer) :
    The problem is that the die gets hot, and heats the substrate secondarily. The silicon on the die has one rate of thermal expansion, the substrate has another, basically they get bigger at different rates. To complicate things further, remember the uneven and changing heating bit above? Parts of the die heat up and expand differently from other parts of the die. This changes quite quickly while things are in use.

    The result? The bumps take a lot of stress, and it changes from second to second. This can be very accurately simulated, and you can engineer bump placement at points of lower thermal expansion and therefore lower stress. If you lose a power bump here and there, the chip will very likely survive, but if you lose a signal bump, game over. This is why bump placement is very important.

    Engineering what bumps go where is a very complex process, and is done basically when the chip is laid out, near the end of the development process. You don't do it on a whim, you don't make pretty patterns because they are cool, you do it scientifically to minimise the potential for damage.

    Getting back to the stress, it is what makes bumps fracture. Think of the old trick of taking a fork and bending it back and forth. It bends several times, then it breaks. The same thing happens to bumps. Heating leads to stress, aka bending, and then it cools and bends back. Eventually this thermal cycling kills chips.
    /Hidden:
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    Quote Originally Posted by suren View Post
    ...
    ~36-48 . CPU 56-65 GPU-. . BIOS (A12), nvidia.
    ...
    - - , 36 (T7500 ). - . , - idle revert- 9, , , 12 - , .
    , . ( ) . , , - , ~43 2-3 , , 5-10 , ... . .
    ( , , , ) - . .
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  5. #5
    Registered User suren's Avatar
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    Quote Originally Posted by 1nsane View Post
    , . ( ) . , , - , ~43 2-3 , , 5-10 , ... . .
    , idle. , .
    ( 2-3), idle. -, , ( ) .

    , (- ) ( - ) AS5 .
    Lenovo Thinkpad Yoga 15

  6. #6
    Non-sane user 1nsane's Avatar
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    AS5, . 100%, , ~50 idle .
    , - , 65/75-80 (/). , .
    | Gigabyte EP35-DS3 | Intel C2D E8400 | Xigmatek S1283 | OCZ Reaper 2x2 GB PC8500 DDR2 |
    | Sapphire HD6950 @ 6970 2GB | Seagate 1TB 32MB + 250GB SATAII 16MB | LG GSA-4163B |
    | Foxconn TLA-570B case | CM Silent Pro M700 | X-Fi Xtreme Music | Logitech X-530 | Belinea 1980S1 |

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